Implacure – An effective and clinically proven protocol for peri-implantitis.

Everything needed for implantoplasty, conditioning and treatment of infra-osseous defects on 3 sites. 

INCLUDED IN THE KIT ARE:

1. Burrs

2. Etching Gel. (37% orthophosphoric acid + 2% Chlorhexidine)

3. Etching Gel delivery tips

4. Syringes and 25 gauge (32) cannulae

5. Tazobactam with Pippericillin* + Hyaluronic Acid 0.5% solution.

*Documented to ‘significantly improve’ all clinical and radiographic parameters at 12 months.

• Peri-implantitis lesions showed 86% disease resolution.

• Suppuration was completely eradicated compared to pre-treatment.

• Probing decreased from 6.4 ± 2.1 mm to 3.2 ± 1.0 mm – a mean reduction of 3.2mm ± 2.0 mm.

• Bone levels increased from 3.2mm at baseline to 5.8mm – a mean defect fill of 2.6mm (± 1.5 mm).

CLINICAL REPORT

*PI with Implantoplasty & Reconstruction_Regueiro_Clin Implant Dent Relat Res. 2021;1–10_LOW RES

VIDEO PROTOCOL

ADDITIONAL FEATURES

The included Hyaluronic Acid is shown to be osteogenic and promotes clot substitution and bone deposition acceleration.

BONE REGENERATION AROUND CLEANED IMPLANTS

Regeneration of bone in contact with a treated implant surface is completed using bone graft substitutes and membranes alone or combined with PRF and/or anti-infectives.  Irrespective of the brand or origin of the biomaterial chosen we recommend the use of fully resorbing materials at the implant surface.    

Why fully resorbing materials only?

• They create maximum space for denovo bone at the implant surface.

• Unlike Non or Slow-resorbing materials they do not leave residual particles reducing bone-to-implant contact area. 

• Non or Slow-resorbing materials with high porosity can be a nidus for trapped pathogens.   

CONTACT US: For advice on topical anti-infectives, elution and delivery from bone grafts and options for PRF, in combination with bone grafts or barrier membranes. 

ORDERING

Implacure is available on special order. Plan a 7-10 day process when scheduling treatments.